Forbes contributors publish independent expert analyses and insights. I write about TV shows, movies, video games, entertainment & culture. This article is more than 3 years old. Bonders is the next ...
A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...
Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...
CHANDLER, Ariz. — In a move to keep pace with Taiwan competitors and ramp production of next-generation chip packages, Amkor Technology Inc. here has placed a major order for 200 leading-edge wire ...
JEC Europe 2012 – Composite bonders, with their ability to maximise the potential of high-end composite structures, are the latest additions to the Araldite range. With high strength properties, the ...
SAINT-JEOIRE, France — Karl Suss France SA, a subsidiary of Munich-based Suss MicroTec AG, said it has completed expansion of a flip-chip bonder production facility here, doubling the plant's capacity ...
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