Supporting the high performance and reliability needed for artificial intelligence (AI), data centers and cloud computing requires powerful and efficient integrated circuits (ICs). More semiconductor ...

As nanometer design projects become more commonplace, the side effects of shrinking process geometries also will grow familiar. The emergence of significant interconnect parasitic elements is chief ...

TSMC has validated Mentor Graphics design tools for its 3D-IC design flow which implements through-silicon via (TSV)-based 3D stacking of semiconductor die. TSMC’s 3D-IC design flow incorporates ...

We are rapidly approaching a future where 5G telecommunications will be the norm. With its increased data speeds and bandwidth, 5G has the potential to change the way we live our lives. But what does ...

Often, there is a need to simulate RFIC designs with substrate parasitics to accurately represent high frequency effects in actual silicon. Generally, parasitics appear from a chip's surface layers, ...

Achieving design closure in a system-on-a-chip (SoC) development project generally requires a great deal of patience. SoCs tend to include more and more custom circuitry, which means long simulation ...