A new technical paper titled “Synaptic and neural behaviours in a standard silicon transistor” was published by researchers ...

Unveiling GPU Bottlenecks in Large-Batch LLM Inference” was published by researchers at Barcelona Supercomputing Center, ...

A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...

New reports on U.S. IC chemicals and materials availability; China export blacklist expands; global fab equipment report; ...

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

The chip industry is exploring multiple avenues for simplifying multi-die integration, but difficulties remain for optimizing ...

Verifying the functionality of a full multi-chip system, including digital controllers, analog electrical, and photonic ...

Number of designs that are late increases. Rapidly rising complexity is the leading cause, but tools, training, and workflows ...

Semiconductor verification is changing to integrate AI with human expertise.

The founders of EDA are retiring, and perhaps it’s time that EDA headed off in a different direction.

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible ...

D materials in 3D transistors; electrochemical memristive mechanism; matching substrates for power electronics.