Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...

TSMC could radically speed up its semiconductor plans in the Untied States: next-gen 2nm mass production at its Arizona fab ...

OpenAI is pushing ahead on its plan to reduce its reliance on Nvidia for its chip supply by developing its first generation ...

AI-created computer chips could revolutionize how our computers run, but scientists say they're so complex we can't ...

After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good design. Chip packaging technology is one of the main keys, and TSMC also ...

Broadcom said its special approach to custom chip design and the IP inside its 3.5D packaging technology enables the efficient correct-by-construction of all power, clock, and signal interconnects ...

From there, researchers work backward in order to package all the resulting pieces ... our reliance on existing templates or form factors for chip design is quite limiting. And even with these ...