Tessolve’s $75 million raise highlights the growing strategic importance of outsourced semiconductor engineering. Chip ...

Choosing an Arm CPU core starts with the workload, not with the processor name. The right core depends on what the chip must do, the software it must run, the power and area available, whether ...

Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...

September 03, 2026 − Chiplet architectures enable complex systems to be built by combining multiple dies within a single ...

TSMC reported US$40.2 billion in second-quarter revenue and a 60.3% operating margin. High-performance computing accounted for two-thirds of revenue, while 2nm made its first measurable contribution ...

Looking for a BGA packaging company for prototype, low-volume or production semiconductor assembly? AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering ...