Microsoft

Microsoft a Leader in The Forrester Wave™ for Endpoint Management Platforms

Endpoint Management Platforms, Q2 2026, with the highest scores in the current offering and strategy categories.

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...
Microsoft

CNAPP evolution: How Microsoft aligns with leading cloud risk management platforms

Discover how Microsoft aligns with the next phase of CNAPP—helping organizations correlate signals, prioritize risk, and ...
IEEE

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

Abstract: In advanced packaging schemes, such as fan-out integration technology, photosensitive polyimide (PSPI) is the key material to the fabrication of panel level redistribution-layer (RDL).
LinkedIn

Microsoft Intune Application Inventory Guide

Microsoft has launched Application Inventory into Intune, alongside the new device view and other features. 🎁 If you're not sure how to make use of it then I've written a quick guide showing the ...
IEEE

A Low-Loss, Broadband, and Compact MMIC Packaging Solution for Sub-Terahertz Applications

Abstract: This article presents a compact, broadband, and low-loss monolithic millimeter-wave integrated circuit (MMIC) packaging solution at sub-terahertz (sub-THz) frequencies. This design employs a ...