Apple is attempting to solve supply issues with a new memory supplier for its upcoming iPhones but it may not be enough.

A leaked iPhone 18 Pro motherboard hints at major A20 chip upgrades, including a new packaging design, better thermal ...

An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip will use a new packaging ...

Azure Linux 4.0 is Microsoft's own Fedora-derived Linux distro for Azure cloud workloads. Here is how it compares to Ubuntu, ...

The packaging bottleneck has become a hot topic in Silicon Valley as TSMC has struggled to keep up with demand.

Artificial intelligence is rapidly shifting from the cloud to the devices we use every day. The first wave of generative AI ...

Kolkata-born Shankh Mitra, CEO of Welltower, received a record $821 million stock compensation for leading senior housing ...

Live Updates Consumer Confidence Just now Live Consumer confidence is looking up. The University of Michigan’s final June ...

A key witness in the trial of a woman accused of helping run a Sydney-to-Hobart ice-trafficking operation has told the ...

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory ...

ROG Zephyrus Duo headlines the 2026 Zephyrus gaming laptops, available in the Philippine starting June 24, 2026. KEY POINTS: 2026 ROG ZEPHYRUS DUO: The world’s first 16-inch dual-screen gaming laptop ...

In Part 1, we looked at the innovations underpinning the Cerebras WSE-3 and why its most significant breakthrough is the elimination of data movement overhead at the architectural ...