Sunnyvale, Calif.—Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to ...
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SK hynix shows 16-Hi HBM4 memory for AI accelerators — 48 GB at 10 GT/s over a 2,048 interface
Avid readers of Tom’s Hardware have read a lot about the upcoming HBM4 and GDDR6 memory technologies, but as neither is used on mass production devices, few of us get to see actual HBM4 and GDDR6 ...
Propelled by the boom in cell phones—in which they support new photography and music features—memory multichip packages (MCPs) are expected see a market that nearly doubles in units and revenue over ...
The new chips seem to be similar to the extant Versal Gen 2 Premium parts, but with the addition of fast LPDDR5X memory directly on the processor package.
Your next smartphone purchase might come with a new type of memory, depending on the model and when you buy it. That is because Samsung has begun mass producing what it claims is the industry's ...
Intel has released a new video showing off its advanced packaging technologies. The goal of the video seems to be to attract customers to its Intel Foundry Services (IFS) business by letting the world ...
Use left and right arrow keys to seek audio. Samsung has just announced that it has developed the industry's first LPDDR5X memory, supporting the industry's highest performance at up to 10.7Gbps. The ...
At the core of AI workloads are memory and storage -- the DRAM and high-bandwidth memory (HBM) chips that keep massive training clusters fed with data at high speeds. As data centers scale to support ...
Posts from this topic will be added to your daily email digest and your homepage feed. And it may abandon desktop GPUs. And it may abandon desktop GPUs. is a senior editor and founding member of The ...
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Intel may be preparing to bring back on-package memory for future mobile processors through a rumored platform known as “Razor Lake-AX.” According to recent industry leaks, the company is ...
Fujitsu Ltd. has developed a high-density memory package for use in mobile phones with 20 percent more capacity than its existing memory packages, the company announced last week. The extra capacity ...
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