Circuits Assembly Magazine online Magazine. Ramp-to-peak (RTP) or ramp-to-spike (RTS) have become the favorite reflow profiles.

2 days ago · Circuits Assembly Magazine online Magazine. TABY, SWEDEN -- Mycronic reported fourth quarter net sales increased 5% to SEK 2.1 billion ($191.9 million).

Feb 6, 2025 · Circuits Assembly Magazine online Magazine. CRANSTON, RI — February 2025 — Federal Electronics, a leader in providing advanced electronic manufacturing services, is proud to introduce its state-of-the-art Class 10,000 cleanroom at its Cranston facility, further strengthening its reputation for exceptional quality and reliability in critical applications.

Circuits Assembly Magazine online Magazine. Inovaxe Expands Partnership with MP Elektronik to Distribute Full Dry Cabinet Storage Line Globally

Dec 10, 2024 · Circuits Assembly Magazine online Magazine. TOKYO – Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $113 billion in 2024 and growing 6.5% year-over-year, SEMI announced in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2024.

Dec 3, 2024 · The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit.

Jan 30, 2025 · While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer efficiency, the initial phase used factory-applied coated stencils to isolate and understand the effects of solder alloy powder size on print performance.

Jan 6, 2025 · The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit.

Jan 6, 2025 · The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit.

Nov 1, 2024 · As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has become a critical challenge. Thermal interface materials (TIMs) are pivotal in ensuring efficient thermal management by facilitating heat transfer between heat-generating components and heat-dissipating devices. Here, we examine the various types of TIMs and their application methods ...