Semiconductor Packaging News
Global Semiconductor Sales Increase 23.2% in Q3 2024 compared to Q3 2023; Quarter-to-Quarter sales up 10.7% Global semiconductor sales soared to $166 billion in Q3 2024, marking a 23.2% annual rise, the largest since 2016, driven by a record September total of $55.3 billion, with notable growth in the Americas at 46.3%.
Semiconductor Packaging News
Advanced Packaging Driving New Collaboration Across Supply Chain. The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges.
Semiconductor Packaging News Index
Although House Speaker Johnson initially suggested ... CNBC. Nov 8, 2024. SUMMARY. Semiconductor firms ASML, AMD, Qualcomm reaffirm China commitment at CIIE trade fair. At Shanghai's CIIE trade fair, global semiconductor giants like ASML, AMD, and Qualcomm showcased advanced tech products, reaffirming their commitment ... South China Morning Post.
Semiconductor Packaging News
October 31, 2024. Back-end Semiconductor Equipment: Advanced Packaging to Propel the Market. The back-end semiconductor equipment market, essential for assembly and packaging, is set to grow in 2025, driven by AI investments and advanced packaging demands. Despite recent declines, revenue should rebound as AI and high-performance computing ...
Semiconductor Packaging News Viewpoint Index
VIEWPOINT 2024: Eelco Bergman, Chief Business Officer, Saras Micro Devices, Inc. Feb 22, 2024. VIEWPOINT 2024: Mohan Iyer, Vice President and General Manager of Semiconductor, Thermo Fisher Scientific. Feb 21, 2024. VIEWPOINT 2024: Glenn Farris, Vice President, Global Customer Operations and Corporate Marketing, Universal Instruments.
Semiconductor Packaging News
Game-Changing Solutions for Power Module and Semiconductor Production with Plasma Technology Plasmatreat GmbH is excited to announce its first participation at the electronica and SEMICON Europa in hall C5 at booth 169.
The Evolution of Interconnects in Microelectronics Packaging
1 day ago · The Evolution of Interconnects in Microelectronics Packaging. Advances in semiconductor packaging, including hybrid bonding and heterogeneous integration, push critical interconnect innovations like direct copper & solder alternatives, boosting signal integrity. These breakthroughs fuel miniaturization & enhance performance in flexible electronics.
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S. This investment aims to enhance performance and competitiveness in microelectronics, addressing key …
Wafer Shipments Remain Soft in 2024 Before Strong Expected …
Global silicon wafer shipments are projected to decline by 2% in 2024 but will rebound with a 10% growth in 2025. Rising demand for AI and advanced processing, along with new applications in packaging and memory, will drive growth through 2027. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
Hybrid Bonding Makes Strides Toward Manufacturability
Hybrid Bonding Makes Strides Toward Manufacturability. Hybrid bonding transforms advanced packaging by creating ultra-dense, high-bandwidth connections essential for AI-driven modular SoCs. However, high costs, complexity, and defect control issues challenge widespread adoption, highlighting a need for improved thermal management solutions.